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A Die E Die 16Gb 2GB 32Gb 4GB 32GB B Die 8Gb 1GB 16GB A Die E Die Die die和wafer的关系. 品质合格的die切割下去后，原来的晶圆成了下图的样子，是挑剩下的Downgrade Flash Wafer。残余的die是品质不合格的晶圆。黑色的部分是合格的die，会被原厂封装制作为成品NAND颗粒，而不合格的部分，也就是图中留下的部分则当做废品处理掉。
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Die Cutting MachineSep 1, 2024 · * die则是晶圆上的单一芯片。 解释： 在半导体的生产过程中，每一个环节都极为重要。测试环节是对产品质量的关键把控。在描述这些术语时，我们可以这样理解： 1. Lot：在整个半导体生产过程中，一批次的产品会经历相似的制造流程和条件。 1 die die die death death die 2 died
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